Heatsinks

Altronics aluminium heatsink range offers a massive selection of types and sizes to suit your project design. Keep devices cool with our Australian made heatsink range. Tunnel, fan, flanged, diecast and device specific heatsinks available.

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Black Anodised. Centre channel is wide enough to accept TO-3 devices. All 105W x 26H mm.

72mm Fan Type Heatsink

H0522
Black Anodised. Centre channel is wide enough to accept TO-3 devices. All 105W x 26H mm.
Thermal Res: 5 deg. C/W

84 x 24 x 28mm Low Profile TO-220 PCB Mount Heatsink

H0669
Thermal Res: 5 deg. C/W
Thermal Res: 5 deg. C/W

84 x 24 x 28mm Low Profile TO-3P PCB Mount Heatsink

H0668
Thermal Res: 5 deg. C/W
A=28 B=12.8 L=37 L = Overall length Thermal Res: 15 deg. C/W

Clip On TO220 Heatsink

H0639
A=28 B=12.8 L=37 L = Overall length Thermal Res: 15 deg. C/W
To suit TO-126 or TO-220 flat pack semis. Thermal resistance: 28C/W. Dimensions: 19W x 19L x 9.5H

Micro U TO220 Heatsink

H0630
To suit TO-126 or TO-220 flat pack semis. Thermal resistance: 28C/W. Dimensions: 19W x 19L x 9.5H
Use with TO-220 package transistors. Features base tabs for PCB location. Thermal resistance: 19C/W. Dimensions: 25W x 30H x 13D

Micro U TO220 PCB Mount Heatsink

H0637
Use with TO-220 package transistors. Features base tabs for PCB location. Thermal resistance: 19C/W. Dimensions: 25W x 30H x 13D
A=13.3 B=9.6 L=19 L = Overall length Thermal Res: 24°C/W

Micro U TO220 PCB Mount Heatsink

H0627
A=13.3 B=9.6 L=19 L = Overall length Thermal Res: 24°C/W
A=13.3 B=9.6 L=19 L = Overall length Thermal Res: 24 deg. C/W

Micro U TO220 PCB Mount Heatsink

H0628
A=13.3 B=9.6 L=19 L = Overall length Thermal Res: 24 deg. C/W
Adhesive backed. Ideal for providing additional cooling to BGA chips. 22 x 22 x 10mm.

Mini BGA Chip Adhesive Backed Heatsink - 22 x 22 x 10mm

H0604
Adhesive backed. Ideal for providing additional cooling to BGA chips. 22 x 22 x 10mm.
Adhesive backed. Ideal for providing additional cooling to PLCC chips. 10 x 10 x 10mm.

Mini PLCC Chip Adhesive Backed Heatsink - 10 x 10 x 10mm

H0600
Adhesive backed. Ideal for providing additional cooling to PLCC chips. 10 x 10 x 10mm.
Adhesive backed. Ideal for providing additional cooling to PLCC chips. 14 x 14 x 11mm

Mini PLCC Chip Adhesive Backed Heatsink - 14 x 14 x 11mm

H0603A
Adhesive backed. Ideal for providing additional cooling to PLCC chips. 14 x 14 x 11mm
Suits flat packs semis. Thermal resistance: 1 deg C/W. Dimensions: 28W x 25L x 34H

Mini U Heatsink

H0625
Suits flat packs semis. Thermal resistance: 1 deg C/W. Dimensions: 28W x 25L x 34H
To suit TO-126 or TO-220 flat pack semis. Thermal resistance: 19C/W. Dimensions: 25W x 30H x 13D

Mini U TO220 Heatsink

H0635
To suit TO-126 or TO-220 flat pack semis. Thermal resistance: 19C/W. Dimensions: 25W x 30H x 13D
A 3 piece set of heatsinks to help cool the CPU, USB controller and RAM chips on the Pi 4. Peel and stick thermal tape backing. Also suitable for use with other development boards.

Raspberry Pi Black Heatsink Set

H0605
A 3 piece set of heatsinks to help cool the CPU, USB controller and RAM chips on the Pi 4. Peel and stick thermal tape backing. Also suitable for use with other development boards.
Just peel and stick to cool your Pi 4 chips with a single heatsink. Just 5mm tall so it doesn’t interfere with HATs.

Raspberry Pi Heatsink 40W x 30L x 5Hmm

H0608
Just peel and stick to cool your Pi 4 chips with a single heatsink. Just 5mm tall so it doesn’t interfere with HATs.
A 3 piece set of heatsinks to help cool the CPU, USB controller and RAM chips on the Pi 4. Peel and stick thermal tape backing. Also suitable for use with other development boards.

Red Heatsink Set for Raspberry Pi

H0607
A 3 piece set of heatsinks to help cool the CPU, USB controller and RAM chips on the Pi 4. Peel and stick thermal tape backing. Also suitable for use with other development boards.
Thermal resistance: 5 deg C/W Dimensions: 50W x 50L x 25H

TO3 Mini Heatsink

H0610
Thermal resistance: 5 deg C/W Dimensions: 50W x 50L x 25H
Use with flat pack or TO-3 package. Thermal resistance:6 deg. C/W. Dimensions: 32W x 61L x 30H

TO3 Universal U Heatsink

H0620
Use with flat pack or TO-3 package. Thermal resistance:6 deg. C/W. Dimensions: 32W x 61L x 30H
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